Scanning imaging system with a novel imaging sensor with gaps for electronic circuitry
US10091445B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 15, 2014 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Sep 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N25/70
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An imaging sensor comprising a 2D array of pixels in an XY coordinate system with gaps for electronic circuitry is presented. Furthermore, a scanning imaging system for imaging an oblique cross section of a sample with such a sensor is provided. Especially when the imaging sensor is in a tilted configuration this sensor is of specific advantages. The sensor allows for maximizing the photoactive part of the pixels in the photosensitive area of the sensor which leads to a maximized the fill factor. Furthermore this leads to a very light sensitive sensor and hence microlenses can be avoided. The gap or gaps of the imaging sensor facilitate also a faster read out because more circuitry can be positioned on the imaging sensor within the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.