Semiconductor structure and manufacturing method thereof
US10096635B2 · kind B2 · utility
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1References
16Claims
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Assignee
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Key dates
| Filing date | Aug 5, 2015 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | Aug 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11
Abstract
A semiconductor structure includes a chip, a light transmissive plate, a spacer, and a light-shielding layer. The chip has an image sensor, a first surface and a second surface opposite to the first surface. The image sensor is located on the first surface. The light transmissive plate is disposed on the first surface and covers the image sensor. The spacer is between the light transmissive plate and the first surface, and surrounds the image sensor. The light-shielding layer is located on the first surface between the spacer and the image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.