Inventor · Taipei, TW

Po-Han Lee

26Patents
3h-index
33Co-inventors
59Inventor score

Filing activity: Jun 13, 2008 → May 5, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US8952519B2 Chip package and fabrication method thereof Electricity 6 Active
US8823179B2 Electronic device package and method for fabricating the same Electricity 4 Active
US8872196B2 Chip package Electricity 3 Active
US10446504B2 Chip package and method for forming the same Electricity 2 Active
US8432032B2 Chip package and fabrication method thereof Electricity 2 Active
US9196571B2 Chip device packages and fabrication methods thereof Electricity 2 Active
US8319347B2 Electronic device package and fabrication method thereof Electricity 1 Active
US9947716B2 Chip package and manufacturing method thereof Electricity 1 Active
US10424540B2 Chip package and method for forming the same Electricity 1 Active
US9640683B2 Electrical contact structure with a redistribution layer connected to a stud Electricity 1 Active
US9780251B2 Semiconductor structure and manufacturing method thereof Electricity 0 Active
US11476293B2 Manufacturing method of chip package Electricity 0 Active
US9269837B2 Chip package and method of manufacturing the same Emerging Cross-Sectional Technologies 0 Active
US11355659B2 Chip package and manufacturing method thereof Electricity 0 Active
US10153237B2 Chip package and method for forming the same Electricity 0 Active
US9214579B2 Electrical contact structure with a redistribution layer connected to a stud Electricity 0 Active
US10096635B2 Semiconductor structure and manufacturing method thereof Electricity 0 Active
US9305842B2 Fabrication methods of chip device packages Electricity 0 Active
US11387201B2 Chip package and manufacturing method thereof Electricity 0 Active
US11038077B2 Chip package and manufacturing method thereof Electricity 0 Active
US11340679B1 Uninterruptible power system testing method Physics 0 Active
US9406818B2 Chip package and method of manufacturing the same Emerging Cross-Sectional Technologies 0 Active
US11310904B2 Chip package and power module Electricity 0 Active
US10879530B2 Anode material of nano-silicon having multilayer-graphene as carrier and coated with silicon suboxide and with amorphous carbon layer and method for fabricating the same Emerging Cross-Sectional Technologies 0 Active
US9875912B2 Chip package and manufacturing method thereof Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.