Patent · US Active

Chip arrangement and a method for manufacturing the same

US10097918B2 · kind B2 · utility

0Cited by

1References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Spoettl · Mintraching, DE
Horst Theuss · Wenzenbach, DE

Key dates

Filing date	Jan 23, 2013
Grant date	Oct 9, 2018
Priority date	—
Expiry date	Jun 10, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH04R19/005
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

In various embodiments, a method for manufacturing a chip arrangement, the method including bonding a microphone chip to a first carrier, the microphone chip including a microphone structure, depositing adhesive material laterally disposed from the microphone structure, and arranging the microphone structure into a cavity of a second carrier such that the adhesive material fixes the microphone chip to the cavity of the second carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.