Use of combined masking techniques and/or combined material removal techniques to protectively coat electronic devices
US10098236B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2015 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | Apr 10, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1383
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Processes for masking electronic devices, including, but not limited to, electronic subassemblies, prior to the application of protective coatings to the electronic devices are disclosed. Such processes include the use of a plurality of different masking techniques in combination to mask the electronic device. Different masking techniques may be used to mask different features and/or components of the electronic device. Some features and/or components may be masked by way of two or more masking techniques. With one or more masks in place, an electronic device may be protectively coated. After a protective coating has been applied to the electronic device, at least a portion of the mask(s) may be removed from the electronic device. Protectively coated electronic devices may then be assembled with one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.