Cleaning composition following CMP and methods related thereto
US10100272B2 · kind B2 · utility
0Cited by
3References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2015 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Jul 17, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a composition for cleaning contaminants from semiconductor wafers following chemical-mechanical polishing. The cleaning composition contains a bulky protecting ligand, an organic amine, an organic inhibitor, and water. The invention also provides methods for using the cleaning composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.