Sensor self-diagnostics using multiple signal paths
US10101379B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2016 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Sep 26, 2036 |
Classification
- Technology area (CPC —)General
Abstract
Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and the systems and/or methods are configured to meet or exceed relevant safety or other industry standards, such as SIL standards. For example, a monolithic integrated circuit sensor system implemented on a single semiconductor ship can include a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path, wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.