Patent · US Active

Space transformation methods

US10101381B2 · kind B2 · utility

0Cited by

0References

10Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Erkan Acar · Melrose, US
Pooya Tadayon · Portland, US
Armen Y. Balian · Portland, US
Ethan Caughey · Hillsboro, US

Key dates

Filing date	Aug 31, 2012
Grant date	Oct 16, 2018
Priority date	—
Expiry date	Dec 19, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49128
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A test system includes a test printed circuit board (PCB), a flip chip package mounted on the PCB, one or more test probes coupled to the flip chip package and a first integrated circuit (IC) coupled to the test probes to enable testing of the first IC using electrical circuitry of the flip chip package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.