Ethan Caughey
5Patents
0h-index
11Co-inventors
38Inventor score
Filing activity: Aug 31, 2012 → Mar 31, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12163982B2 | Microbump cluster probing architecture for 2.5D and 3D dies | Physics | 0 | Active |
| US10101381B2 | Space transformation methods | Emerging Cross-Sectional Technologies | 0 | Active |
| US10429439B2 | In die stepping sort | Electricity | 0 | Active |
| US11486923B2 | Apparatuses and methods for mitigating sticking of units-under-test | Physics | 0 | Active |
| US11740282B1 | Apparatuses and methods for monitoring health of probing u-bump cluster using current divider | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.