Methods for integrating a compliant material with a substrate
US10101857B2 · kind B2 · utility
1Cited by
20References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2015 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | May 10, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2217/960765
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A sensor module can include a sensor that is configured to detect any given input or environmental conditions, such as, for example, touch or force inputs. The sensor module can be included in an electronic device. Methods for producing the sensor module are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.