Method and system for detecting hotspots in semiconductor wafer
US10102615B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2016 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Apr 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and system for detecting hotspots in semiconductor wafer are provided. At least one semiconductor wafer is inspected to detect a plurality of hotspots of each die in the semiconductor wafer, wherein each of the hotspots has defect coordinates in a layout of the die. The hotspots of the dies are stacked in the layout according to the defect coordinates of the hotspots. A common pattern is obtained according to the stacked hotspots corresponding to a location with specific coordinates in the layout. It is determined whether the common pattern is a known pattern having an individual identification (ID) code. A new ID code is assigned to the common pattern when the common pattern is an unknown pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.