Patent · US Active

Elastic mounting of power modules

US10104812B2 · kind B2 · utility

1Cited by

15References

1Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Reinhold Bayerer · Warstein, DE
Georg Borghoff · Warstein, DE

Key dates

Filing date	Sep 1, 2011
Grant date	Oct 16, 2018
Priority date	—
Expiry date	Jul 21, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4935
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor module includes a base plate having an inner region adjacent an edge region, a substrate attached to the inner region of the base plate and a heat sink on which the base plate is mounted so that the base plate is interposed between the substrate and the heat sink and at least part of the inner region of the base plate contacts the heat sink. The module further includes a stress relief mechanism configured to permit the base plate to bend away from the heat sink in the edge region responsive to a thermal load so that at least part of the inner region of the base plate remains in contact with the heat sink.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.