Dual-cure nanostructure transfer film
US10106643B2 · kind B2 · utility
2Cited by
26References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2015 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Mar 31, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A transfer film includes a template layer having a first major surface and an opposing second major surface. The second major surface includes a structured non-planar release surface. A backfill layer is disposed upon and conforms to the non-planar structured surface. The backfill layer includes a first cross-linked polymer and a plurality of multifunctional monomers, which cure via different and independent curing mechanisms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.