Shijing Cheng
9Patents
1h-index
28Co-inventors
43Inventor score
Filing activity: Mar 27, 2013 → Dec 23, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10106643B2 | Dual-cure nanostructure transfer film | Electricity | 2 | Active |
| US11884850B2 | Adhesive film including a (meth)acrylate matrix including a curable epoxy/thiol resin composition, tape, and method | Chemistry; Metallurgy | 0 | Active |
| US9422387B2 | Dual responsive block copolymer compositions | Chemistry; Metallurgy | 0 | Active |
| US10844247B2 | Adhesive article backing with sorbent material | Chemistry; Metallurgy | 0 | Active |
| US11905438B2 | Process of manufacturing a pressure sensitive adhesive having a low VOC characteristics | Chemistry; Metallurgy | 0 | Active |
| US12275876B2 | Hot melt processable (meth)acrylate-based medical adhesives | Chemistry; Metallurgy | 0 | Active |
| US11292940B2 | Polymeric adhesive layers as ceramic precursors | Chemistry; Metallurgy | 0 | Active |
| US10975221B2 | Crosslinkable composition including a (meth)acrylic polymer and methods of making a crosslinked composition | Chemistry; Metallurgy | 0 | Active |
| US10518512B2 | Method of forming dual-cure nanostructure transfer film | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.