Thermoplastic poromeric polishing pad

US10106662B2 · kind B2 · utility

Assignee

• Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

• Shuiyuan Luo · Newark, US
• George C. Jacob · Newark, US
• Henry Sanford-Crane · Elkton, US
• Koichi Yoshida · Shizuoka, JP
• Katsumasa Kawabata · Osaka, JP
• Shusuke Kitawaki · Ooda, JP
• Shogo Takahashi · Adachi, JP
• Yosuke Takei · Adachi, JP

Key dates

• Filing date: Aug 4, 2016
• Grant date: Oct 23, 2018
• Expiry date: Mar 6, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08J2475/04
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The porous polyurethane polishing pad includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores are interconnected with small pores. The porous matrix is a blend of two thermoplastic polymers. The first thermoplastic polyurethane has by molecular percent, 45 to 60 adipic acid, 10 to 30 MDI-ethylene glycol and 15 to 35 MDI and an Mn of 40,000 to 60,000 and a Mw of 125,000 to 175,000 and an Mw to Mn ratio of 2.5 to 4 The second thermoplastic polyurethane has by molecular percent, 40 to 50 adipic acid, 20 to 40 adipic acid butane diol, 5 to 20 MDI-ethylene glycol and 5 to 25 MDI and an Mn of 60,000 to 80,000 and a Mw of 125,000 to 175,000 and an Mw to Mn ratio of 1.5 to 3.