George C. Jacob
33Patents
3h-index
49Co-inventors
59Inventor score
Filing activity: Jul 28, 2008 → Jun 10, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9484212B1 | Chemical mechanical polishing method | Electricity | 5 | Active |
| US8829101B2 | Windmill propeller blade and method of making same | Emerging Cross-Sectional Technologies | 4 | Active |
| US9925637B2 | Tapered poromeric polishing pad | Performing Operations; Transporting | 3 | Active |
| US8742018B2 | High Tg epoxy systems for composite applications | Chemistry; Metallurgy | 3 | Active |
| US9206349B2 | Powder coated proppant and method of making the same | Chemistry; Metallurgy | 3 | Active |
| US9475168B2 | Polishing pad window | Performing Operations; Transporting | 2 | Active |
| US10259099B2 | Tapering method for poromeric polishing pad | Performing Operations; Transporting | 2 | Active |
| US10106662B2 | Thermoplastic poromeric polishing pad | Chemistry; Metallurgy | 2 | Active |
| US10569384B1 | Chemical mechanical polishing pad and polishing method | Electricity | 2 | Active |
| US10086494B2 | High planarization efficiency chemical mechanical polishing pads and methods of making | Performing Operations; Transporting | 1 | Active |
| US9586304B2 | Controlled-expansion CMP PAD casting method | Chemistry; Metallurgy | 1 | Active |
| US11285577B2 | Thin film fluoropolymer composite CMP polishing method | Chemistry; Metallurgy | 1 | Active |
| US10391606B2 | Chemical mechanical polishing pads for improved removal rate and planarization | Performing Operations; Transporting | 1 | Active |
| US10464187B2 | High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives | Performing Operations; Transporting | 1 | Active |
| US10293456B2 | Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them | Electricity | 1 | Active |
| US9630293B2 | Chemical mechanical polishing pad composite polishing layer formulation | Electricity | 1 | Active |
| US9452507B2 | Controlled-viscosity CMP casting method | Chemistry; Metallurgy | 1 | Active |
| US10464188B1 | Chemical mechanical polishing pad and polishing method | Chemistry; Metallurgy | 1 | Active |
| US11638978B2 | Low-debris fluopolymer composite CMP polishing pad | Electricity | 0 | Active |
| US10144115B2 | Method of making polishing layer for chemical mechanical polishing pad | Performing Operations; Transporting | 0 | Active |
| US10105825B2 | Method of making polishing layer for chemical mechanical polishing pad | Performing Operations; Transporting | 0 | Active |
| US9315664B2 | High Tg epoxy systems for composite applications | Chemistry; Metallurgy | 0 | Active |
| US11491605B2 | Fluopolymer composite CMP polishing method | Electricity | 0 | Active |
| US9388311B2 | Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers | Chemistry; Metallurgy | 0 | Active |
| US11524390B2 | Methods of making chemical mechanical polishing layers having improved uniformity | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.