GMR sensor within molded magnetic material employing non-magnetic spacer

US10107875B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Klaus Elian · Alteglofsheim, DE
• Martin Petz · Hohenkammer, DE
• Uwe Schindler · Reichenbach, DE
• Horst Theuss · Wenzenbach, DE
• Adolf Koller · Regensburg, DE

Key dates

• Filing date: Nov 30, 2009
• Grant date: Oct 23, 2018
• Expiry date: Nov 21, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N50/80
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.