Heat dissipating device with improved cooling performance
US10108237B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2017 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | May 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/40
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipating device includes a first copper plate, a second copper plate, a plurality of first heat pipes, a plurality of second heat pipes, and a heat dissipating component. Evaporating sections of the first heat pipes and the second heat pipes are clamped between and thermally connected to the first copper plate and the second copper plate. The second heat pipe, the evaporating section of the first heat pipes, the first copper plate, and the second copper plate are positioned at a bottom surface of the heat dissipating component. The second copper plate is thermally connected to the bottom surface of the heat dissipating component. Condensing sections of the first heat pipes is thermally connected to a top surface of heat dissipating component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.