Qiao Chen
11Patents
3h-index
19Co-inventors
53Inventor score
Filing activity: May 12, 2006 → Mar 26, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9275934B2 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Electricity | 38 | Active |
| US7277281B1 | Heat dissipation device having wire fixture | Electricity | 12 | Expired |
| US10108237B1 | Heat dissipating device with improved cooling performance | Electricity | 3 | Active |
| US10672718B2 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Electricity | 3 | Active |
| US11094611B2 | Liquid cooled heat dissipation device | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US12009319B2 | Integrated circuit with metal stop ring outside the scribe seal | Electricity | 0 | Active |
| US11942386B2 | Electronic devices in semiconductor package cavities | Electricity | 0 | Active |
| US11855024B2 | Wafer chip scale packages with visible solder fillets | Electricity | 0 | Active |
| US10477731B1 | Liquid-cooled radiator | Physics | 0 | Active |
| US9138840B2 | Method for manufacturing a heat sink | Emerging Cross-Sectional Technologies | 0 | Active |
| US12255115B2 | Electronic devices in semiconductor package cavities | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.