Substrate treating apparatus, substrate treating method, and plasma generating unit
US10109459B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2017 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Aug 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32174
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed are a substrate treating The substrate treating apparatus includes a plasma generating unit the plasma generating unit includes a plasma generating chamber having a space, into which a gas is introduced, a first antenna wound to surround the plasma generating chamber and connected to a power source through a first electric wire, a second antenna wound to surround the housing and connected to the power source through a second electric wire to be disposed in parallel to the first antenna, and power distributing members provided in the first antenna and the second antenna to distribute electric power supplied from the power source to the first antenna and the second antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.