Support unit and apparatus for treating substrate
US10109466B2 · kind B2 · utility
0Cited by
5References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 2, 2014 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | May 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68714
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a support unit. The support unit includes a support plate having a top surface in which a measurement groove is defined and on which a substrate is placed, and a sensor for measuring a pressure in the measurement groove in the state where the substrate is placed on the support plate. The measurement groove has a main measurement groove that extends from a central area of the support plate up to an edge area of the support plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.