Method for fabricating handling wafer
US10109474B1 · kind B1 · utility
13Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2017 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | May 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating handling wafer includes providing a substrate, having a front side and a back side. The front side of the substrate is disposed on a supporting pin. A first oxide layer is formed surrounding the substrate. A portion of the first oxide layer is removed to expose the front side of the substrate. An alignment mark is formed on the front side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.