Patent · US Active

Composite abrasive particles for chemical mechanical planarization composition and method of use thereof

US10109493B2 · kind B2 · utility

1Cited by

1References

21Claims

0Family size

Assignee

Versum Materials US, LLC · US

Inventors

Hongjun Zhou · Beijing, CN
Jo-Ann Theresa Schwartz · Chadds Ford, US
Malcolm Grief · Boise, US
Xiaobo Shi · Chandler, US
Krishna P. Murella · Phoenix, US
Steven Charles Winchester · Phoenix, US
John Edward Quincy Hughes · Tempe, US
Mark Leonard O'Neill · San Marcos, US
Andrew J. Dodd · Tempe, US
Dnyanesh Chandrakant Tamboli · Tempe, US
Reinaldo Mario Machado · Allentown, US

Key dates

Filing date	Jan 12, 2016
Grant date	Oct 23, 2018
Priority date	—
Expiry date	Apr 2, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/24
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

Chemical Mechanical Planarization (CMP) polishing compositions comprising composite particles, such as ceria coated silica particles, offer low dishing, low defects, and high removal rate for polishing oxide films. Chemical Mechanical Planarization (CMP) polishing compositions have shown excellent performance using soft polishing pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.