Malcolm Grief
34Patents
10h-index
33Co-inventors
75Inventor score
Filing activity: Apr 14, 1989 → Sep 9, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5326428A | Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability | Emerging Cross-Sectional Technologies | 239 | Expired |
| US5514245A | Method for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratches | Emerging Cross-Sectional Technologies | 184 | Expired |
| US5738562A | Apparatus and method for planar end-point detection during chemical-mechanical polishing | Performing Operations; Transporting | 105 | Expired |
| US5523697A | Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof | Emerging Cross-Sectional Technologies | 101 | Expired |
| US7026835B2 | Engagement probe having a grouping of projecting apexes for engaging a conductive pad | Emerging Cross-Sectional Technologies | 94 | Expired |
| US8666505B2 | Wafer-scale package including power source | Electricity | 42 | Active |
| US4936950A | Method of forming a configuration of interconnections on a semiconductor device having a high integration density | Electricity | 42 | Expired |
| US5136362A | Electrical contact with diffusion barrier | Electricity | 38 | Expired |
| US5166093A | Method to reduce the reflectivity of a semi-conductor metallic surface | Emerging Cross-Sectional Technologies | 31 | Expired |
| US6960115B2 | Multiprobe detection system for chemical-mechanical planarization tool | Electricity | 11 | Expired |
| US6805613B1 | Multiprobe detection system for chemical-mechanical planarization tool | Electricity | 9 | Expired |
| US6392426B1 | Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6124721A | Method of engaging electrically conductive test pads on a semiconductor substrate | Emerging Cross-Sectional Technologies | 5 | Expired |
| USRE34583E | Method of forming a configuration of interconnections on a semiconductor device having a high integration density | General | 5 | Expired |
| US6686758B1 | Engagement probe and apparatuses configured to engage a conductive pad | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6614249B1 | Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6555466B1 | Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers | Electricity | 4 | Expired |
| US6657450B2 | Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6670819B2 | Methods of engaging electrically conductive pads on a semiconductor substrate | Emerging Cross-Sectional Technologies | 2 | Expired |
| US9978609B2 | Low dishing copper chemical mechanical planarization | Chemistry; Metallurgy | 2 | Active |
| US6387188B1 | Pad conditioning for copper-based semiconductor wafers | Performing Operations; Transporting | 1 | Expired |
| US6127195A | Methods of forming an apparatus for engaging electrically conductive pads and method of forming a removable electrical interconnect apparatus | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6380754B1 | Removable electrical interconnect apparatuses including an engagement proble | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9318400B2 | Wafer-scale package including power source | Electricity | 1 | Active |
| US10109493B2 | Composite abrasive particles for chemical mechanical planarization composition and method of use thereof | Performing Operations; Transporting | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.