Methods and apparatuses for determining a parameter of a die
US10109551B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2015 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | May 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N19/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure provide techniques and configurations for integrally determining a parameter (e.g., temperature) of a die of an integrated circuit. In one instance, the apparatus may comprise a die including a first (e.g., remote) area and a second (e.g., local) area disposed at a distance from the first area, and circuitry to determine a parameter associated with the remote area of the die. The circuitry may include: a first sensing device disposed in the remote area, to provide first readings associated with the parameter; a second sensing device disposed in the local area, to provide second readings associated with the parameter; and a control module coupled with the sensing devices and disposed in the local area, to facilitate a determination of the parameter based on the first and second readings provided by the first and second sensing devices. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.