Integrated circuit heat dissipation using nanostructures

US10109553B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Alan B. Botula · South Burlington, US
• Max L. Lifson · Burlington, US
• James A. Slinkman · Montpelier, US
• Theodore G. van Kessel · Millbrook, US
• Randy L. Wolf · South Burlington, US

Key dates

• Filing date: Mar 28, 2017
• Grant date: Oct 23, 2018
• Expiry date: Mar 28, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D62/121
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.