Die-on-interposer assembly with dam structure and method of manufacturing the same
US10115650B2 · kind B2 · utility
4Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2016 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Nov 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes an interposer chip having a frontside, a backside, and a corner area on the backside defined by a first corner edge and a second corner edge of the interposer chip. A die is bonded to the frontside of the interposer chip. At least one dam structure is formed on the corner area of the backside of the interposer chip. The dam structure includes an edge aligned to at least one the first corner edge and the second corner edge of the interposer chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.