Inventor · Sanxing, TW

Chih-Wei Wu

117Patents
9h-index
103Co-inventors
83Inventor score

Filing activity: Jan 7, 2004 → Jun 20, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US10529690B2 Package structures and methods of forming the same Electricity 33 Active
US8518753B2 Assembly method for three dimensional integrated circuit Electricity 29 Active
US9570421B2 Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure Electricity 22 Active
US9368458B2 Die-on-interposer assembly with dam structure and method of manufacturing the same Electricity 20 Active
US10867965B2 Package structures and methods of forming the same Electricity 17 Active
US8580683B2 Apparatus and methods for molding die on wafer interposers Electricity 13 Active
US7054670B2 Cellular phone structure and portable electronic apparatus Electricity 13 Expired
US7474527B2 Desktop personal computer and thermal module thereof Electricity 12 Active
US9337096B2 Apparatus and methods for molding die on wafer interposers Electricity 10 Active
US10861799B1 Dummy die placement without backside chipping Electricity 8 Active
US8749077B2 Three-dimensional integrated circuit (3DIC) Emerging Cross-Sectional Technologies 8 Active
US7379051B2 Foldable computer mouse Physics 8 Active
US10529637B1 Integrated circuit package and method of forming same Electricity 7 Active
US8557684B2 Three-dimensional integrated circuit (3DIC) formation process Emerging Cross-Sectional Technologies 7 Active
US9704825B2 Chip packages and methods of manufacture thereof Electricity 7 Active
USD511518S1 Mouse General 7 Expired
US9768227B2 Light-emitting element having a plurality of light-emitting structures Electricity 7 Active
US11289424B2 Package and method of manufacturing the same Electricity 6 Active
US8501590B2 Apparatus and methods for dicing interposer assembly Electricity 5 Active
US8541883B2 Semiconductor device having shielded conductive vias Electricity 5 Active
US10115650B2 Die-on-interposer assembly with dam structure and method of manufacturing the same Electricity 4 Active
USD509506S1 Pen mouse General 4 Expired
US11410897B2 Semiconductor structure having a dielectric layer edge covering circuit carrier Electricity 4 Active
US10510684B2 Three dimensional integrated circuit (3DIC) with support structures Electricity 4 Active
USD872040S1 Super thin two-screen display General 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.