RFID tag assembly methods
US10116033B1 · kind B1 · utility
8Cited by
22References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2016 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Sep 23, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.