Stress decoupling in MEMS transducers
US10117028B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2017 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Jan 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A MEMS transducer (200) comprises a substrate (101) having a first surface (102) and a membrane (103) formed relative to an aperture in the substrate. The MEMS transducer (200) further comprises one or more bonding structures (107) coupled to the substrate, wherein the one or more bonding structures (107), during use, mechanically couple the MEMS transducer to an associated substrate (111). The MEMS transducer (200) comprises a sealing element (109) for providing a seal, during use, in relation to the substrate (101) and the associated substrate (111). A stress decoupling member (119) is coupled between the substrate (101) and the sealing element (109).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.