Inventor · Austin, TX, US

David Patten

16Patents
4h-index
20Co-inventors
60Inventor score

Filing activity: Nov 22, 2002 → Oct 25, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7262615B2 Method and apparatus for testing a semiconductor structure having top-side and bottom-side connections Physics 17 Expired
US7479407B2 Digital and RF system and method therefor Electricity 13 Expired
US8044494B2 Stackable molded packages and methods of making the same Electricity 12 Active
US7808258B2 Test interposer having active circuit component and method therefor Physics 5 Active
US10334339B2 MEMS transducer package Electricity 3 Active
US10455309B2 MEMS transducer package Electricity 2 Active
US11299392B2 Packaging for MEMS transducers Electricity 1 Active
US11881343B2 Layered process-constructed double-winding embedded solenoid inductor Electricity 1 Active
US10252906B2 Package for MEMS device and process Electricity 1 Active
US10696545B2 Transducer packaging Electricity 0 Active
US10735868B2 MEMS packaging Electricity 0 Active
US12217898B2 Method for constructing a solenoid inductor Electricity 0 Active
US10469956B2 MEMS transducer package Electricity 0 Active
US11252513B2 Packaging for a MEMS transducer Electricity 0 Active
US11942468B2 Symmetric layout for high-voltage amplifier Electricity 0 Active
US10117028B2 Stress decoupling in MEMS transducers Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.