Probe head assemblies and probe systems for testing integrated circuit devices

US10120020B2 · kind B2 · utility

Assignee

• FormFactor Beaverton, Inc. · US

Inventors

• Jay Scott Salmon · San Diego, US
• Roy E. Swart · Hillsboro, US
• Brandon Liew · Beaverton, US

Key dates

• Filing date: Jun 16, 2016
• Grant date: Nov 6, 2018
• Expiry date: Nov 23, 2036

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R1/07378
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Probe head assemblies and probe systems for testing integrated circuit devices are disclosed herein. In one embodiment, the probe head assemblies include a contacting structure and a space transformer assembly. In another embodiment, the probe head assemblies include a contacting structure, a suspension system, a flex cable interface, and a space transformer including a space transformer body and a flex cable assembly. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, and a planarization layer. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, a suspension system, a platen, a printed circuit board, a first plurality of signal conductors configured to convey a first plurality of signals external to the space transformer, and a second plurality of signal conductors configured to convey a second plurality of signals via the space transformer. The probe systems include the probe head assemblies.