On-bonder automatic overhang die optimization tool for wire bonding and related methods
US10121759B2 · kind B2 · utility
1Cited by
1References
11Claims
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Key dates
| Filing date | Aug 11, 2016 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Oct 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.