Stephen Babinetz
6Patents
4h-index
8Co-inventors
46Inventor score
Filing activity: Sep 19, 2002 → Sep 26, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7229906B2 | Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine | Electricity | 123 | Expired |
| US7188759B2 | Methods for forming conductive bumps and wire loops | Electricity | 13 | Expired |
| US7464854B2 | Method and apparatus for forming a low profile wire loop | Emerging Cross-Sectional Technologies | 7 | Active |
| US7651022B2 | Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine | Electricity | 4 | Active |
| US10121759B2 | On-bonder automatic overhang die optimization tool for wire bonding and related methods | Electricity | 1 | Active |
| US10665564B2 | On-bonder automatic overhang die optimization tool for wire bonding and related methods | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.