Bezels for die level packaging of camera modules, and associated camera modules and methods
US10122903B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2016 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Aug 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/026
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bezel for die level packaging of a camera module may include (a) a recessed lip surrounding an aperture of the bezel and facing in a first direction, wherein the recessed lip is configured for seating thereon an image sensor, and (b) a planar rim surrounding the aperture and facing in a second direction opposite the first direction, wherein the planar rim is configured for bonding thereto a wafer-level lens unit implementing a wafer-level lens for delivering light to the image sensor through the aperture, wherein transverse extent of the planar rim across the aperture in a dimension orthogonal to the first direction exceeds corresponding transverse extent of the recessed lip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.