Inventor · Baoshan, TW

Tsung-Wei Wan

15Patents
1h-index
5Co-inventors
39Inventor score

Filing activity: Oct 28, 2013 → Apr 28, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US9349765B2 Suspended lens system having a non-zero optical transmission substrate facing the concave surface of a single-piece lens and wafer-level method for manufacturing the same Electricity 1 Active
US9804367B2 Wafer-level hybrid compound lens and method for fabricating same Physics 1 Active
US9386203B2 Compact spacer in multi-lens array module Electricity 1 Active
US10333277B2 Structure light module using vertical cavity surface emitting laser array Electricity 1 Active
US9902120B2 Wide-angle camera using achromatic doublet prism array and method of manufacturing the same Physics 1 Active
US9451137B2 PCB-mountable lens adapter for a PCB-mountable camera module Electricity 1 Active
US9467606B2 Wafer level stepped sensor holder Electricity 1 Active
US10122903B2 Bezels for die level packaging of camera modules, and associated camera modules and methods Electricity 0 Active
US10075636B2 Ultra-small camera module with wide field of view, and associate lens systems and methods Electricity 0 Active
US11538269B2 Optical fingerprint sensor for LCD panel Physics 0 Active
US11280988B2 Structure light module using vertical cavity surface emitting laser array and folding optical element Electricity 0 Active
US9915763B2 Stacked-lens assembly and fabrication method for same Performing Operations; Transporting 0 Active
US10469718B2 Camera module having baffle between two glass substrates Electricity 0 Active
US10455131B2 Wafer-level methods for packing camera modules, and associated camera modules Performing Operations; Transporting 0 Active
US10437025B2 Wafer-level lens packaging methods, and associated lens assemblies and camera modules Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.