Manufacturing method for metallic housing of electronic device
US10124405B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 23, 2016 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | May 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/04
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold including a male die and a female die; positioning an outer frame in a cavity of the female die, the outer frame including a plurality of latching portions protruding from an inner surface inwardly and a plurality of latching grooves, each latching portion including at least one receiving groove; assembling the male die to the female die; casting pressured molten metal-alloy into the cavity to form an inner structural member embedded in the outer frame, the inner structural member including a plurality of engaging portions respectively embedded in the plurality of receiving grooves, and a plurality of matching portions respectively embedded in the plurality of latching grooves; dissembling the male die from the female die; and removing the outer frame and the inner structural member from the female die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.