Power chip
US10126795B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2017 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Jun 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D99/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power chip includes: a first power switch, formed in a wafer region and having a first metal electrode and a second metal electrode; a second power switch, formed in the wafer region and having a third metal electrode and a fourth metal electrode, wherein the first and second power switches respectively constitute an upper bridge arm and a lower bridge arm of a bridge circuit, and the first and second power switches are alternately arranged along at least one dimension direction; and a metal region, at least including a first metal layer, a second metal layer and a third metal layer that are stacked in sequence, each metal layer including a first strip electrode, a second strip electrode and a third strip electrode, and strip electrodes with the same voltage potential in two adjacent metal layers are electrically coupled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.