Yan Chen
12Patents
2h-index
16Co-inventors
47Inventor score
Filing activity: Sep 15, 2009 → Mar 16, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9876003B2 | Electrostatic discharge protection circuit and configuration method | Electricity | 4 | Active |
| US10198020B2 | Interleaved parallel circuit, integrated power module and integrated power chip | Emerging Cross-Sectional Technologies | 3 | Active |
| US10985645B2 | Alternatingly-switched parallel circuit, integrated power module and integrated power package | Emerging Cross-Sectional Technologies | 2 | Active |
| US11227856B2 | Multi-chip package power module | Electricity | 1 | Active |
| US10620654B2 | Alternatingly-switched parallel circuit, integrated power module and integrated power package | Emerging Cross-Sectional Technologies | 1 | Active |
| US10629550B2 | Power integrated module | Electricity | 0 | Active |
| US10126795B2 | Power chip | Electricity | 0 | Active |
| US11399438B2 | Power module, chip-embedded package module and manufacturing method of chip-embedded package module | Electricity | 0 | Active |
| US10871811B2 | Power chip | Electricity | 0 | Active |
| US10826483B2 | Power chip and bridge circuit | Emerging Cross-Sectional Technologies | 0 | Active |
| US8766627B2 | Angle position sensor | Physics | 0 | Active |
| US11024588B2 | Power integrated module | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.