Defect detection and classification based on attributes determined from a standard reference image
US10127652B2 · kind B2 · utility
5Cited by
17References
53Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 2, 2015 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Jan 29, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for classifying defects detected on a wafer are provided. One method includes detecting defects on a wafer based on output generated for the wafer by an inspection system. The method also includes determining one or more attributes for at least one of the defects based on portions of a standard reference image corresponding to the at least one of the defects. The method further includes classifying the at least one of the defects based at least in part on the one or more determined attributes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.