Adhesive film for semiconductor chip with through electrode
US10131826B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2015 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Mar 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06541
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive film for a semiconductor chip with a through electrode, which is used for stacking multiple semiconductor chips each with a through electrode on a semiconductor wafer, which can favorably connect the through electrodes while suppressing formation of voids, and which can reduce the length of burrs protruding around the semiconductor chips. An adhesive film for a semiconductor chip with a through electrode, to be used for stacking multiple semiconductor chips each with a through electrode on a semiconductor wafer, the adhesive film having a minimum melt viscosity of 50 to 2500 Pa·s and a thixotropic index at 140° C. of 8 or lower.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.