Inventor · Tokyo, JP

Kohei Takeda

28Patents
8h-index
29Co-inventors
71Inventor score

Filing activity: Jul 17, 2008 → Jan 27, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
USD939404S1 Front bumper for an automobile General 31 Active
USD913549S1 Front combination lamp for an automobile General 31 Active
USD939403S1 Front bumper for an automobile General 31 Active
USD939405S1 Front bumper for an automobile General 29 Active
USD921545S1 Front bumper for an automobile General 27 Active
USD658321S1 Rear light for an automobile General 21 Expired
US7838577B2 Adhesive for electronic component Electricity 18 Active
USD942347S1 Wheel for an automobile General 13 Active
USD856871S1 Rear bumper for an automobile General 8 Active
USD1035069S1 Front combination lamp for an automobile General 4 Active
USD1033700S1 Front combination lamp for an automobile General 3 Active
USD1033699S1 Front combination lamp for an automobile General 3 Active
USD1048939S1 Passenger car General 2 Active
US10772984B2 Elastic porous film and article Chemistry; Metallurgy 1 Active
US11471549B2 Stretchable film and article comprising same Emerging Cross-Sectional Technologies 0 Active
US8901207B2 Adhesive for electronic components Electricity 0 Active
US10723107B2 Elastic laminate and article containing same Textiles; Paper 0 Active
US10889089B2 Stretchable film, stretchable laminate and article comprising same Performing Operations; Transporting 0 Active
USD1005916S1 Wheel for an automobile General 0 Active
US11305034B2 Stretchable film and product including same Chemistry; Metallurgy 0 Active
US8563362B2 Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles Emerging Cross-Sectional Technologies 0 Active
US11369528B2 Stretchable laminate and article comprising same Performing Operations; Transporting 0 Active
US11421107B2 Curable resin composition, cured product, adhesive, bonding film, coverlay film, flexible copper-clad laminate and circuit board Emerging Cross-Sectional Technologies 0 Active
US12139576B2 Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board Electricity 0 Active
US10131826B2 Adhesive film for semiconductor chip with through electrode Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.