Method of forming surface protrusions on an article and the article with the protrusions attached
US10132836B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2015 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Feb 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an Integrated Circuit (IC) chip, a test probe for the IC chip or any suitable substrate or nanostructure. The surface protrusions are electroplated to a template or mold wafer, transferred to the article and easily separated from the template wafer. Thus, the attached protrusions may be, e.g., micro-bumps or micro pillars on an IC chip or substrate, test probes on a probe head, or one or more cantilevered membranes in a micro-machine or micro-sensor or other micro-electro-mechanical systems (MEMS) formed without undercutting the MEMS structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.