John U. Knickerbocker
308Patents
26h-index
289Co-inventors
93Inventor score
Filing activity: May 2, 1986 → Nov 17, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7402442B2 | Physically highly secure multi-chip assembly | Emerging Cross-Sectional Technologies | 224 | Expired |
| US6000033A | Password control via the web | Electricity | 151 | Expired |
| US6358627B2 | Rolling ball connector | Emerging Cross-Sectional Technologies | 149 | Expired |
| US6528145B1 | Polymer and ceramic composite electronic substrates | Emerging Cross-Sectional Technologies | 118 | Expired |
| US5130067A | Method and means for co-sintering ceramic/metal MLC substrates | Electricity | 113 | Expired |
| US8213184B2 | Method of testing using a temporary chip attach carrier | Emerging Cross-Sectional Technologies | 107 | Active |
| US5480503A | Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof | Emerging Cross-Sectional Technologies | 89 | Expired |
| US6209007A | Web internet screen customizing system | Emerging Cross-Sectional Technologies | 78 | Expired |
| US6270363A | Z-axis compressible polymer with fine metal matrix suspension | Electricity | 78 | Expired |
| US7768005B2 | Physically highly secure multi-chip assembly | Emerging Cross-Sectional Technologies | 70 | Active |
| US7781883B2 | Electronic package with a thermal interposer and method of manufacturing the same | Electricity | 69 | Active |
| US6136419A | Ceramic substrate having a sealed layer | Emerging Cross-Sectional Technologies | 59 | Expired |
| US6177729A | Rolling ball connector | Emerging Cross-Sectional Technologies | 53 | Expired |
| US8048794B2 | 3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport | Electricity | 49 | Active |
| US5541005A | Large ceramic article and method of manufacturing | Emerging Cross-Sectional Technologies | 49 | Expired |
| US8138015B2 | Interconnection in multi-chip with interposers and bridges | Electricity | 46 | Active |
| US6023407A | Structure for a thin film multilayer capacitor | Emerging Cross-Sectional Technologies | 44 | Expired |
| US6327598A | Removing a filled-out form from a non-interactive web browser cache to an interactive web browser cache | Physics | 41 | Expired |
| US8008764B2 | Bridges for interconnecting interposers in multi-chip integrated circuits | Electricity | 35 | Active |
| US6258627A | Underfill preform interposer for joining chip to substrate | Emerging Cross-Sectional Technologies | 34 | Expired |
| US8344512B2 | Three-dimensional silicon interposer for low voltage low power systems | Electricity | 33 | Active |
| US6489686B2 | Multi-cavity substrate structure for discrete devices | Electricity | 31 | Expired |
| US5888308A | Process for removing residue from screening masks with alkaline solution | Electricity | 29 | Expired |
| US5260519A | Multilayer ceramic substrate with graded vias | Electricity | 29 | Expired |
| US6184062A | Process for forming cone shaped solder for chip interconnection | Emerging Cross-Sectional Technologies | 27 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.