Polycrystalline ceramic substrate and method of manufacture
US10134589B2 · kind B2 · utility
6Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2017 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Jun 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/018
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a ceramic substrate structure includes providing a ceramic substrate, encapsulating the ceramic substrate in a barrier layer, and forming a bonding layer coupled to the barrier layer. The method further includes removing a portion of the bonding layer to expose at least a portion of the barrier layer and define fill regions, and depositing a second bonding layer on the at least a portion of the exposed barrier layer and the fill regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.