Stress monitoring device and method of manufacturing the same
US10134645B2 · kind B2 · utility
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1References
20Claims
0Family size
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Key dates
| Filing date | Mar 29, 2017 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Mar 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A stress monitoring device includes an anchor structure, a freestanding structure and a Vernier structure. The anchor structure is over a substrate. The freestanding structure is over the substrate, wherein the freestanding structure is connected to the anchor structure and includes a free end suspended from the substrate. The Vernier structure is over the substrate and adjacent to the free end of the freestanding structure, wherein the Vernier structure comprises scales configured to measure a displacement of the free end of the freestanding structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.