Inventor

Chen-Fa Lu

22Patents
4h-index
25Co-inventors
63Inventor score

Filing activity: Oct 10, 2000 → Mar 7, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6517413B1 Method for a copper CMP endpoint detection system Performing Operations; Transporting 60 Expired
US6555477B1 Method for preventing Cu CMP corrosion Electricity 19 Expired
US9793243B2 Buffer layer(s) on a stacked structure having a via Electricity 15 Active
US6524959B1 Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and control Performing Operations; Transporting 4 Expired
US10510723B2 Buffer layer(s) on a stacked structure having a via Electricity 4 Active
US8629053B2 Plasma treatment for semiconductor devices Electricity 3 Active
US10269701B2 Semiconductor structure with ultra thick metal and manufacturing method thereof Electricity 2 Active
US10128113B2 Semiconductor structure and manufacturing method thereof Electricity 2 Active
US11270978B2 Buffer layer(s) on a stacked structure having a via Electricity 1 Active
US8636559B2 Method for wafer back-grinding control Electricity 0 Active
US9418955B2 Plasma treatment for semiconductor devices Electricity 0 Active
US8716858B2 Bump structure with barrier layer on post-passivation interconnect Electricity 0 Active
US10134645B2 Stress monitoring device and method of manufacturing the same Electricity 0 Active
US12021066B2 Buffer layer(s) on a stacked structure having a via Electricity 0 Active
US8710458B2 UV exposure method for reducing residue in de-taping process Emerging Cross-Sectional Technologies 0 Active
US11670584B2 Semiconductor structure with ultra thick metal and manufacturing method thereof Electricity 0 Active
US8571699B2 System and method to reduce pre-back-grinding process defects Performing Operations; Transporting 0 Active
US10665456B2 Semiconductor structure Electricity 0 Active
US8298041B2 System and method for wafer back-grinding control Electricity 0 Active
US11114378B2 Semiconductor structure with ultra thick metal and manufacturing method thereof Electricity 0 Active
US9508659B2 Method and apparatus to protect a wafer edge Electricity 0 Active
US10534353B2 System and method to reduce pre-back-grinding process defects Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.