Circuit package with segmented external shield to provide internal shielding between electronic components
US10134682B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2015 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Nov 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/0576
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A module includes a circuit package having multiple electronic components on a substrate, a molded compound disposed over the substrate and the electronic components, and an external shield disposed on at least one outer surface of the circuit package. The external shield is segmented into multiple external shield partitions that are grounded, respectively. Adjacent external shield partitions of the multiple external shield partitions are separated by a corresponding gap located between adjacent electronic components of the multiple electronic components. The external shield is configured to protect the circuit package from external electromagnetic radiation and environmental stress. Each corresponding gap separating the adjacent external shield partitions is configured to provide internal shielding of at least one of the electronic components, between which the corresponding gap is located, from internal electromagnetic radiation generated by the other of the adjacent electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.