Li Sun
15Patents
3h-index
22Co-inventors
56Inventor score
Filing activity: Feb 25, 2013 → May 29, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD983984S1 | Warm belt | General | 11 | Active |
| USD1041022S1 | Neck massager | General | 4 | Active |
| USD1047157S1 | Warm belt | General | 3 | Active |
| US10134682B2 | Circuit package with segmented external shield to provide internal shielding between electronic components | Electricity | 1 | Active |
| US9997428B2 | Via structures for thermal dissipation | Electricity | 1 | Active |
| US10364504B2 | Fabrication of multilayered nanosized porous membranes and their use for making novel nanostructures | Performing Operations; Transporting | 1 | Active |
| US10827617B2 | Printed circuit board with cavity | Electricity | 1 | Active |
| US12113032B2 | Substrate having undercut portion for stress mitigation | Electricity | 0 | Active |
| US11723143B1 | Thermal dissipation and shielding improvement using merged PCB bottom copper post | Electricity | 0 | Active |
| US12137516B2 | Package with self shielding | Electricity | 0 | Active |
| US11724115B2 | System and method for reducing heat of an implantable medical device during wireless charging | Human Necessities | 0 | Active |
| US9907169B1 | Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB | Electricity | 0 | Active |
| US9865479B2 | Method of attaching components to printed cirucuit board with reduced accumulated tolerances | Electricity | 0 | Active |
| US12156423B2 | Composite film and manufacturing method thereof, and encapsulation structure including the composite film | Electricity | 0 | Active |
| US11276650B2 | Stress mitigation structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.