Patent · US Active

Bonding method for connecting two wafers

US10134707B2 · kind B2 · utility

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16Claims

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Assignee

Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

Kai Zoschke · Berlin, DE
Michael Töpper · Berlin, DE

Key dates

Filing date	Feb 10, 2017
Grant date	Nov 20, 2018
Priority date	—
Expiry date	Feb 10, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/94
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention relates to a bonding method for connecting a first wafer and a second wafer, wherein firstly a first adhesive layer is deposited onto a surface of the first wafer. Furthermore, a second adhesive layer is deposited onto the first adhesive layer, and the two adhesive layers are structured by way of selective removal of both adhesive layers in at least one predefined region of the first wafer, Moreover, the first wafer is connected to the second wafer by way of pressing a surface of the second wafer onto the second adhesive layer, wherein the second adhesive layer is more flowable that the first adhesive layer on connecting the first wafer to the second wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.